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FLEXIBLE PCBs PRODUCTION PROCESS CAPEL Advanced FPC, what makes it different? |
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| Raw Material | Branded raw material (Dupont, Panasonic, Shengyi, TAIFLEX, ARLON, 3M, etc.); Halogen-free material; Large size & stable performance material; |
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| Drilling | Numerical control drilling; Laser micro drilling; |
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| PTH | Copper plating; Nanometer graphene coating; |
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| Electroplating | Gantry style electroplate; VCP continuous vertical plating; |
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| Trace | LDI laser exposure process; | |||
| Etching | Vacuum etching | |||
| Lamination | Automatic machine film Alignment | |||
| Testing Method | 4-wire flying probe testing; 4-wire in-circuit testing |
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| Surface Finishes | Immersion Gold; OSP; Electroless Nickel/Electroless Palladium/Immersion Gold; |
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| Assembly | Jig Assembly; Automatic reinforcement Assembly |
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| Printing | High-resolution Inkjet Printing | |||
| Profile | High Precision Die Punching; Laser Cut |
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FPC Production Process
Shenzhen Capel Technology Co., Ltd.
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RIGID-FLEX PCBs PRODUCTION PROCESS CAPEL Advanced Rigid-Flex PCB, what makes it different? |
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| Raw Material | Branded raw material (Dupont, Panasonic, Shengyi, TAIFLEX, ARLON, 3M, etc.); Halogen-free material; Large size & stable performance material; |
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| Drilling | Numerical control drilling; Laser micro drilling; |
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| PTH | Copper plating; Nanometer graphene coating; |
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| Electroplating | Gantry style electroplate; VCP continuous vertical plating; |
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| Trace | LDI laser exposure process; | |||
| Etching | Vacuum etching | |||
| Lamination | Automatic machine film Alignment | |||
| Testing Method | 4-wire flying probe testing; 4-wire in-circuit testing |
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| Surface Finishes | Immersion Gold; OSP; Electroless Nickel/Electroless Palladium/Immersion Gold; |
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| Assembly | Jig Assembly; Automatic reinforcement Assembly |
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| Printing | High-resolution Inkjet Printing | |||
| Profile | High Precision Die Punching; Laser Cut |
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Rigid-Flex PCBs Production Process
Shenzhen Capel Technology Co., Ltd.
| PCB PRODUCTION PROCESS
CAPEL Premium PCB, what makes it different? |
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| Raw Material | High performance FR4; Halogen-free FR4; Large size & stable performance material; |
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| Ink | High performance ink; Halogen-free ink; |
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| Drilling | Numerical control drilling; Laser micro drilling; |
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| PTH | Copper plating; Nanometer graphene coating; |
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| Electroplating | Gantry style electroplate; VCP continuous vertical plating; |
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| Trace | Parallel light exposure process; LDI laser exposure process; |
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| Etching | Chemical etching; Laser etching; Vacuum etching; |
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| Stack-up | Hot oil press machine (large-scale); | ||||||
| Soldermask | Exposure developing process; Silkscreen printing process; Electrostatic spraying process; Vacuum printing process; Resin/ink plug hole process; |
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| Silkscreen | Screen printing process Hd inkjet printing process |
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| PCB Profile | High precision numerical control machine tab-routing process; | ||||||
PCB Production Process
Shenzhen Capel Technology Co., Ltd.
| PCBA PRODUCTION PROCESS
CAPEL High Quality pcba, what makes it different? |
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| High Quality | A-Grade Raw Materials Advanced Siemens PCBA Machines Operators with 15 Years Experience |
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| Quick Turnaround | Online Quote in Minutes Smart Production Scheduling System Expedited DHL Delivery within 2-4 Days |
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| Low Cost | Highly Automated, Lower Cost FREE Stencil and Set-up & Tooling Incremental Deductions with More Orders |
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| Dedicated Customer Service | 7*24 Online Customer Service Professional Technical Support High-Performance Supply Chain |
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PCBA Production Process
Shenzhen Capel Technology Co., Ltd.
