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Rigid PCB Technology FAQ

  • How are ceramic circuit boards tested for electrical performance?

    In this blog post, we will explore the various methods used to test the electrical performance of ceramic circuit boards. Ceramic circuit boards are becoming increasingly popular in various industries due to their superior electrical performance, reliability and durability. However, as with any e...
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  • Sizes and dimensions of ceramic circuit boards

    Sizes and dimensions of ceramic circuit boards

    In this blog post, we will explore the typical sizes and dimensions of ceramic circuit boards. Ceramic circuit boards are becoming more and more popular in the electronics industry due to their superior characteristics and performance compared to traditional PCBs (Printed Circuit Boards). Also kn...
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  • 3 Layer Pcb surface treatment process:immersion gold and OSP

    3 Layer Pcb surface treatment process:immersion gold and OSP

    When choosing a surface treatment process (such as immersion gold, OSP, etc.) for your 3-layer PCB, it can be a daunting task. Since there are so many options, it is essential to choose the most appropriate surface treatment process to meet your specific requirements. In this blog post, we’ll dis...
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  • Solves Electromagnetic Compatibility Issues in Multilayer Circuit Boards

    Solves Electromagnetic Compatibility Issues in Multilayer Circuit Boards

    Introduction : Welcome to Capel, a well-known PCB manufacturing company with 15 years of industry experience. At Capel, we have a high-quality R&D team, rich project experience, strict manufacturing technology, advanced process capabilities and strong R&D capabilities. In this blog, we...
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  • 4-Layer PCB Stackups Drilling Accuracy and Hole Wall Quality : Capel’s Expert Tips

    4-Layer PCB Stackups Drilling Accuracy and Hole Wall Quality : Capel’s Expert Tips

    Introduce: When manufacturing printed circuit boards (PCBs), ensuring drilling accuracy and hole wall quality in a 4-layer PCB stack is critical to the overall functionality and reliability of the electronic device. Capel is a leading company with 15 years of experience in the PCB industry, with ...
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  • Flatness and size control issues in 2-layer PCB stack-ups

    Flatness and size control issues in 2-layer PCB stack-ups

    Welcome to Capel’s blog, where we discuss all things PCB manufacturing-related. In this article, we will address common challenges in 2-layer PCB stackup construction and provide solutions to address flatness and size control issues. Capel has been a leading manufacturer of Rigid-Flex PCB, ...
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  • Multi-layer PCB internal wires and external pad connections

    Multi-layer PCB internal wires and external pad connections

    How to effectively manage conflicts between internal wires and external pad connections on multi-layer printed circuit boards? In the world of electronics, printed circuit boards (PCBs) are the lifeline that connects various components together, allowing for seamless communication and functionali...
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  • Line width and spacing specifications for 2-layer PCBs

    Line width and spacing specifications for 2-layer PCBs

    In this blog post, we will discuss the basic factors to consider when selecting line width and space specifications for 2-layer PCBs. When designing and manufacturing printed circuit boards (PCBs), one of the key considerations is determining appropriate line width and spacing specifications. The...
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  • Control the thickness of 6-layer PCB within the allowable range

    Control the thickness of 6-layer PCB within the allowable range

    In this blog post, we will explore various techniques and considerations to ensure that the thickness of a 6-layer PCB remains within the required parameters. As technology develops, electronic devices continue to become smaller and more powerful. This advancement has led to the development of co...
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  • Copper thickness and die-casting process for 4L PCB

    Copper thickness and die-casting process for 4L PCB

    How to choose the appropriate in-board copper thickness and copper foil die-casting process for 4-layer PCB When designing and manufacturing printed circuit boards (PCBs), there are many factors to consider. A key aspect is choosing the appropriate in-board copper thickness and copper foil die-ca...
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  • Choose multilayer printed circuit board stacking method

    Choose multilayer printed circuit board stacking method

    When designing multilayer printed circuit boards (PCBs), choosing the appropriate stacking method is critical. Depending on the design requirements, different stacking methods, such as enclave stacking and symmetric stacking, have unique advantages. In this blog post, we’ll explore how to choose ...
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  • Choose materials suitable for multiple PCB

    Choose materials suitable for multiple PCB

    In this blog post, we’ll discuss key considerations and guidelines for choosing the best materials for multiple PCB. When designing and producing multilayer circuit boards, one of the most critical factors to consider is choosing the right materials. Choosing the right materials for a multilayer ...
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