4. Reliability and durability: IoT devices are often deployed in harsh environments, exposed to vibrations, temperature fluctuations, and moisture. Compared with traditional rigid or flex PCB, multilayer rigid-flex PCB has higher durability and reliability. The combination of rigid and flexible layers provides mechanical stability and reduces the risk of interconnect failure. 5. High-density interconnect: IoT devices often require high-density interconnects to accommodate various components and functions. Multilayer Rigid-Flex PCBs provide multilayer interconnections, allowing for increased circuit density and more complex designs. 6. Miniaturization: IoT devices continue to become smaller and more portable. Multilayer rigid-flex PCBs enable the miniaturization of electronic components and circuits, allowing the development of compact IoT devices that can be easily integrated into various applications. 7. Cost efficiency: Although the initial manufacturing cost of multilayer rigid-flex PCBs may be higher compared to traditional PCBs, they can save costs in the long run. Integrating multiple components on a single board reduces the need for additional wiring and connectors, simplifies the assembly process and reduces overall production costs.