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Customized PCB 12 Layer Rigid-Flex PCBs Factory for Mobile Phone

Short Description:

Product application: Mobile Phone

Board Layers: 12 layer(4 layer flex +8 layer Rigid)

Base material: PI, FR4

Inner Cu thickness: 18um

Outer Cu thickness: 35um

Special Process:Gold edging

Cover film color: Yellow

Solder mask color: Green

Silkscreen: White

Surface treatment: ENIG

Flex thickness: 0.23mm +/-0.03m

Rigid thickness: 1.6mm +/-10%

Stiffener type:/

Min Line width/space: 0.1/0.1mm

Min hole: 0.1nm

Blind hole: Yes

Buried hole: Yes

Hole tolerance(mm): PTH: 士0.076, NTPH: 士0.05

Impedance :/


Product Detail

Product Tags

Specification

Category Process Capability Category Process Capability
Production Type Single layer FPC / Double layers FPC
Multi- layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number 1-16 layers FPC
2-16 layers Rigid-FlexPCB
HDI Boards
Max Manufacture Size Single layer FPC 4000mm
Doulbe layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board Thickness FPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface Finish Immersion Gold/Immersion
Silver/Gold Plating/Tin Plat ing/OSP
Stiffener FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size Min 0.4mm Min Line Space/ width 0.045mm/0.045mm
Thickness Tolerance ±0.03mm Impedance 50Ω-120Ω
Copper Foil Thickness 9um/12um / 18um / 35um / 70um/100um Impedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mm The Min Flush Width 0.80mm
Min Via Hole 0.1mm Implement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III

We do customized PCB with 15 years' experience with our professionalism

product description01

5 layer Flex-Rigid Boards

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8 layer Rigid-Flex PCBs

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8 layer HDI PCBs

Testing and Inspection Equipment

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Microscope Testing

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AOI Inspection

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2D Testing

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Impedance Testing

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RoHS Testing

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Flying Probe

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Horizontal Tester

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Bending Teste

Our customized PCB Service

. Provide technical support Pre-sales and after-sales;
. Custom up to 40 layers, 1-2days Quick turn reliable prototyping, Component procurement, SMT Assembly;
. Caters to both Medical Device, Industrial Control, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications etc..
. Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.

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The specific application of 12 layer Rigid-Flex PCBs in mobile phone

1. Interconnection: Rigid-flex boards are used for the interconnection of different electronic components inside mobile phones, including microprocessors, memory chips, displays, cameras and other modules. The multiple layers of the PCB allow for complex circuit designs, ensuring efficient signal transmission and reducing electromagnetic interference.

2. Form factor optimization: The flexibility and compactness of rigid-flex boards allow mobile phone manufacturers to design sleek and thin devices. The combination of rigid and flexible layers allows the PCB to bend and fold to fit into tight spaces or conform to the shape of the device, maximizing valuable internal space.

3. Durability and reliability: Mobile phones are subjected to various mechanical stresses such as bending, twisting and vibration.
Rigid-flex PCBs are designed to withstand these environmental elements, ensuring long-term reliability and preventing damage to the PCB and its components. The use of high-quality materials and advanced manufacturing techniques enhance the overall durability of the device.

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4. High-density wiring: The multi-layer structure of the 12-layer rigid-flex board can increase the wiring density, enabling the mobile phone to integrate more components and functions. This helps to miniaturize the device without compromising its performance and functionality.

5. Improved signal integrity: Compared with traditional rigid PCBs, rigid-flex PCBs provide better signal integrity.
The flexibility of the PCB reduces signal loss and impedance mismatch, thereby increasing the performance and data transfer rate of high-speed data connections, mobile applications such as Wi-Fi, Bluetooth and NFC.

12-layer rigid-flex boards in mobile phones have some advantages and complementary use

1. Thermal management: Phones generate heat during operation, especially with demanding applications and processing tasks.
Rigid-flex PCB's multi-layer flexible structure enables efficient heat dissipation and thermal management.
This helps prevent overheating and ensures long-lasting device performance.

2. Component integration, saving space: Using 12-layer soft-rigid board, mobile phone manufacturers can integrate various electronic components and functions into one board. This integration saves space and simplifies manufacturing by eliminating the need for additional circuit boards, cables and connectors.

3. Robust and durable: 12-layer rigid-flex PCB is highly resistant to mechanical stress, shock and vibration.
This makes them suitable for rugged mobile phone applications such as outdoor smartphones, military-grade equipment, and industrial handhelds that require durability and reliability in harsh environments.

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4. Cost-effective: While rigid-flex PCBs may have higher initial costs than standard rigid PCBs, they can reduce overall manufacturing and assembly costs by eliminating additional interconnect components such as connectors, wires, and cables.
The streamlined assembly process also reduces the chance for error and minimizes rework, resulting in cost savings.

5. Design flexibility: The flexibility of rigid-flex PCBs allows for innovative and creative smartphone designs.
Manufacturers can take advantage of unique form factors by creating curved displays, foldable smartphones, or devices with unconventional shapes. This differentiates the market and enhances user experience.

6. Electromagnetic Compatibility (EMC): Compared with traditional rigid PCBs, rigid-flexible PCBs have better EMC performance.
The layers and materials used are designed to help mitigate electromagnetic interference (EMI) and ensure compliance with regulatory standards. This improves signal quality, reduces noise and improves overall device performance.


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