4 layer HDI blind buried flex-rigid pcb for communication electronic devices

Short Description:

Product Type: 4 layer HDI Flex-Rigid PCB
Applications: Communication electronic equipment
Material: PI,Copper,adhesive，FR4
Line width and line spacing：0.1mm/0.1mm
Board thickness：0.45mm +/- 0.03mm
Minimum hole:0.1mm
Blind hole: L1-L2,L3-L4
Buried hole:L2-L3
Plating hole filling: Yes
Surface Treatment:ENIG 2-3uin

Impedance:/

Tolerance tolerance:±0.1MM

Capel’s Service:

Support Custom 1-30 Layer FPC Flexible PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,HDI PCB,Reliable Quick Turn PCB Prototyping,Fast Turn SMT PCB Assembly

Industry We Service:

Medical Device, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…

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Product Detail

Product Tags

Our High-precision, High-density 4-Layer HDI Rigid-Flex PCB, specially designed Prototyped prototyped to meet the needs of Communication Electronic Equipment.

-Capel with 15 years of professional technical experience-

Introducing our high-precision, high-density 4-layer HDI hard-software PCB, specially designed to meet the needs of communication electronic equipment. This cutting-edge PCB solution is designed using the highest quality materials including PI, copper, adhesives and FR4, ensuring the highest quality and reliability.

Our PCB line width and line spacing are 0.1mm/0.1mm, and the board thickness is 0.45mm +/- 0.03mm, providing unparalleled precision and accuracy. The minimum via size of 0.1mm enables complex and delicate designs, while blind via (L1-L2, L3-L4) and buried via (L2-L3) capabilities provide additional flexibility for complex electronic applications.

Our 4-layer HDI rigid and flexible PCBs also feature plated hole filling and ENIG 2-3uin surface treatment, further enhancing their performance and durability. No impedance tolerance ensures seamless and uninterrupted functionality, while an overall tolerance of ±0.1mm guarantees consistent and reliable results.

This high-quality PCB solution is designed to meet the demanding requirements of communications electronics. Its high density and compact design make it ideal for space-constrained applications without compromising performance or functionality.

multi-layer HDI PCBs in supporting high-speed, low-latency 5G network
and infrastructure deployments

The flexibility of the rigid-flex design allows it to be easily integrated into various electronic devices, providing reliable and efficient solutions for modern communication technology.

Our 4-layer HDI rigid and flexible PCBs are the result of advanced engineering and meticulous attention to detail, making them the perfect choice for manufacturers looking for high-performance, reliable solutions for their communications electronics equipment. With our commitment to quality and precision, this PCB ensures reliable and long-lasting performance that meets stringent industry standards.

In summary, our 4-layer HDI rigid-flex PCB is the epitome of high precision, high density and high quality, providing cutting-edge solutions for communication electronics equipment. Its innovative design, top-quality materials and advanced features make it an excellent choice for manufacturers looking to improve product performance and reliability. Choose our PCB solutions for seamless integration, impeccable performance and peace of mind.

Capel Flexible PCB & Rigid-Flex PCB Process Capability

Category	Process Capability	Category	Process Capability
Production Type	Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB	Layers Number	1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards
Max Manufacture Size	Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm	Insulating Layer Thickness	27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um
Board Thickness	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Tolerance of PTH Size	±0.075mm
Surface Finish	Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Min 0.4mm	Min Line Space/ width	0.045mm/0.045mm
Thickness Tolerance	±0.03mm	Impedance	50Ω-120Ω
Copper Foil Thickness	9um/12um / 18um / 35um / 70um/100um	Impedance Controlled Tolerance	±10%
Tolerance of NPTH Size	±0.05mm	The Min Flush Width	0.80mm
Min Via Hole	0.1mm	Implement Standard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III

Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism

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Testing and Inspection Equipment

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Capel provide customers customized PCB Service with 15 years of experience

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.