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Process Capability

CAPEL FPC & Flex-Rigid PCB Production Capability

Product High Density
Interconnect ( HDI)
Standard Flex circuits Flex Flat Flexible Circuits Rigid Flex Circuit Membrane Switches
Standard Panel Size 250mm X 400mm Roll fomat 250mmX400mm 250mmX400mm
line width and Spacing  0.035mm    0.035mm 0 .010"(0.24mm) 0.003"(0.076mm) 0.10"(.254mm)
Copper Thickness 9um/12um / 18um / 35um / 70um/100um/140um 0.028mm-.01mm 1/2 oz.and higher 0.005"-.0010"
Layer Count 32 Single 32 Up to 40
VIA / DRILL SIZE
Minimum Drill ( Mechanical ) Hole Diameter 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) N / A 0.006" ( 0.15 mm) 10 mil ( 0.25 mm)
Minimum Via ( Laser ) Size 4 mil ( 0.1mm ) 1 mil ( 0.025 mm ) N / A 6 mil ( 0.15 mm ) N / A
Minimum Micro Via ( Laser ) Size 3 mil (0.076 mm ) 1 mil ( 0.025 mm ) N / A 3 mil ( 0.076 mm) N / A
Stiffener Material Polyimide / FR4 / Metal /SUS /Alu PET FR-4 / Poyimide PET / Metal/FR-4
Shielding Material Copper / silver Lnk / Tatsuta / Carbon Silver Foil/Tatsuta Copper / Silver Ink/Tatduta / Carbon Silver Foil
Tooling Material 2 mil ( 0.051 mm ) 2 mil ( 0.051 mm ) 10 mil ( 0.25mm) 2 mil (0.51 mm) 5 mil ( 0.13 mm )
Zif Tolerance 2 mil ( .051 mm ) 1 mil ( 0.025 mm ) 10 mil ( 0.25mm) 2 mil (0.51 mm) 5 mil ( 0.13 mm )
SOLDER MASK
Solder Mask Bridge Between Dam 5 mil ( .013 mm ) 4 mil (0 .01mm ) N / A 5 mil ( 0.13 mm ) 10 mil ( 0.25mm)
Solder Mask Registration Tolerance 4 mil ( .010 mm ) 4 mil( 0.01mm ) N / A 5 mil ( 0.13 mm ) 5 mil ( 0.13 mm )
COVERLAY
Coverlay Registration 8 mil 5 mil 10 mil 8 mil 10 mil
PIC Registration 7 mil 4 mil N / A 7 mil N / A
Solder Mask Registration 5 mil 4 mil N / A 5 mil 5 mil
Surface Finish ENIG/Immersion Silver/Immersion Tin/Gold Plating/Tin Plating/OSP/ ENEPIG
Legend
Minimum Height 35 mil 25 mil 35 mil 35 mil Graphic Overlay
Minimun width 8 mil 6 mil 8 mil 8 mil
Minimum Space 8 mil 6 mil 8 mil 8 mil
Registration ±5mil ±5mil ±5mil ±5mil
Impedance ±10% ±10% ±20% ±10% NA
SRD ( Steel Rule Die )
Outline Tolerance 5 mil ( 0.13 mm ) 2 mil ( 0.051 mm) N / A 5 mil ( 0.13 mm ) 5 mil ( 0.13 mm )
Minimum radius 5 mil ( 0.13 mm ) 4 mil ( 0.10 mm ) N / A 5 mil ( 0.13 mm ) 5 mil ( 0.13 mm )
Inside Radius 20 mil ( 0.51 mm ) 10 mil ( 0.25 mm) N / A 31 mil 20 mil ( 0.51 mm )
Punch Minimum Hole Size 40 mil ( 10.2 mm ) 31.5 mil ( 0.80 mm) N / A N / A 40 mil (1.02 mm )
Tolerance of Punch Hole Size ± 2mil ( 0.051 mm) ± 1 mil N / A N / A ± 2 mil ( 0.051 mm )
Slot Width 20 mil ( 0.51 mm ) 15 mil ( 0.38 mm ) N / A 31 mil 20 mil ( 0.51 mm )
Toleranc of hole to outline ±3 mil ± 2 mil N / A ±4 mil 10 mil
Tolerance of hole edge to outline ±4 mil ± 3 mil N / A ±5 mil 10 mil
Minimum of Trace to outline 8 mil 5mil N / A 10 mil 10 mil

CAPEL PCB Production Capability

Technical Parameters
No. Project Technical  indicators
1 Layer 1-60(layer)
2 Maximum processing area 545 x 622 mm
3 Minimumboardthickness 4(layer)0.40mm
6(layer) 0.60mm
8(layer) 0.8mm
10(layer)1.0mm
4 Minimum line width 0.0762mm
5 Minimum spacing 0.0762mm
6 Minimum mechanical aperture 0.15mm
7 Hole wall copper thickness 0.015mm
8 Metallized aperture tolerance ±0.05mm
9 Non-metallized aperture tolerance ±0.025mm
10 Hole tolerance ±0.05mm
11 Dimensional tolerance ±0.076mm
12 Minimum solder bridge 0.08mm
13 Insulation resistance 1E+12Ω(normal)
14 Plate thickness ratio 1:10
15 Thermal shock 288 ℃(4 times in 10 seconds)
16 Distorted and bent ≤0.7%
17 Anti-electricity strength >1.3KV/mm
18 Anti-stripping  strength 1.4N/mm
19 Solder resist hardness ≥6H
20 Flame retardancy 94V-0
21 Impedance control ±5%

CAPEL PCBA Production Capability

Category Details
Lead Time 24 hours Prototyping,the delivery time of small-batch is about 5 days.
PCBA Capacity SMT patch 2 million points/day, THT 300,000 points/day, 30-80 orders /day.
Components Service Turnkey With mature and effective component procurement management system, we serve PCBA projects with high-cost performance. A team of professional procurement engineers and experienced procurement personnel is responsible for the procurement and management of components for our customers.
Kitted or Consigned With a strong procurement management team and component supply chain, Customers provide us with components, we do the assembly work.
Combo Accept components or special components are provided by customers. and also components resourcing for customers.
PCBA Solder Type SMT, THT, or PCBA soldering services both.
Solder Paste/Tin Wire/Tin Bar lead and lead-free (RoHS compliant) PCBA processing services. And also provide customized solder paste.
Stencil laser cutting stencil to ensure that components such as small-pitch ICs and BGA to meet IPC-2 Class or higher.
MOQ 1 piece, but we advise our customers to produce at least 5 samples for their own analysis and testing.
Component Size • Passive components: we are good at fitting the inch 01005 (0.4mm * 0.2mm), 0201 such small components.
• High-precision ICs such as BGA: We can detect BGA components with Min 0.25mm spacing by X-ray.
Component Package reel, cutting tape, tubing, and pallets for SMT components.
Maximum Mount Accuracy of Components (100FP) Accuracy is 0.0375mm.
Solderable PCB Type PCB (FR-4, metal substrate), FPC, Rigid-flex PCB, Aluminum PCB,HDI PCB.
Layer 1-30(layer)
Maximum processing area 545 x 622 mm
Minimumboardthickness 4(layer)0.40mm
6(layer) 0.60mm
8(layer) 0.8mm
10(layer)1.0mm
Minimum line width 0.0762mm
Minimum spacing 0.0762mm
Minimum mechanical aperture 0.15mm
Hole wall copper thickness 0.015mm
Metallized aperture tolerance ±0.05mm
Non-metallized aperture ±0.025mm
Hole tolerance ±0.05mm
Dimensional tolerance ±0.076mm
Minimum solder bridge 0.08mm
Insulation resistance 1E+12Ω(normal)
Plate thickness ratio 1:10
Thermal shock 288 ℃(4 times in 10 seconds)
Distorted and bent ≤0.7%
Anti-electricity strength >1.3KV/mm
Anti-stripping  strength 1.4N/mm
Solder resist hardness ≥6H
Flame retardancy 94V-0
Impedance control ±5%
File Format BOM,PCB Gerber, Pick and Place.
Testing Before delivery, we will apply a variety of test methods to the PCBA in mount or already mount:
• IQC: incoming inspection;
• IPQC: in-production inspection, LCR test for the first piece;
• Visual QC: routine quality check;
• AOI: soldering effect of patch components, small parts or polarity of components;
• X-Ray: check BGA, QFN and other high precision is hidden PAD components;
• Functional Testing: Test function and performance according to customer's testing procedures and procedures to ensure compliance.
Repair & Rework Our BGA Repair Service can safely remove misplaced, off-position, and falsified BGA and reattach them to the PCB perfectly.