Production Process-Pcb Manufacturer, Rigid Flex Pcb, Flexible Pcb

PCBA PRODUCTION PROCESS

CAPEL High Quality pcba, what makes it different?

High Quality

A-Grade Raw Materials
Advanced Siemens PCBA Machines
Operators with 15 Years Experience

Quick Turnaround

Online Quote in Minutes
Smart Production Scheduling System
Expedited DHL Delivery within 2-4 Days

Highly Automated, Lower Cost
FREE Stencil and Set-up & Tooling
Incremental Deductions with More Orders

Dedicated Customer Service

7*24 Online Customer Service
Professional Technical Support
High-Performance Supply Chain

FLEXIBLE PCBs PRODUCTION PROCESS CAPEL Advanced FPC, what makes it different?
Raw Material	Branded raw material (Dupont, Panasonic, Shengyi, TAIFLEX, ARLON, 3M, etc.); Halogen-free material; Large size & stable performance material;
Drilling	Numerical control drilling; Laser micro drilling;
PTH	Copper plating; Nanometer graphene coating;
Electroplating	Gantry style electroplate; VCP continuous vertical plating;
Trace	LDI laser exposure process;
Etching	Vacuum etching
Lamination	Automatic machine film Alignment
Testing Method	4-wire flying probe testing; 4-wire in-circuit testing
Surface Finishes	Immersion Gold; OSP; Electroless Nickel/Electroless Palladium/Immersion Gold;
Assembly	Jig Assembly; Automatic reinforcement Assembly
Printing	High-resolution Inkjet Printing
Profile	High Precision Die Punching; Laser Cut

RIGID-FLEX PCBs PRODUCTION PROCESS CAPEL Advanced Rigid-Flex PCB, what makes it different?
Raw Material	Branded raw material (Dupont, Panasonic, Shengyi, TAIFLEX, ARLON, 3M, etc.); Halogen-free material; Large size & stable performance material;
Drilling	Numerical control drilling; Laser micro drilling;
PTH	Copper plating; Nanometer graphene coating;
Electroplating	Gantry style electroplate; VCP continuous vertical plating;
Trace	LDI laser exposure process;
Etching	Vacuum etching
Lamination	Automatic machine film Alignment
Testing Method	4-wire flying probe testing; 4-wire in-circuit testing
Surface Finishes	Immersion Gold; OSP; Electroless Nickel/Electroless Palladium/Immersion Gold;
Assembly	Jig Assembly; Automatic reinforcement Assembly
Printing	High-resolution Inkjet Printing
Profile	High Precision Die Punching; Laser Cut

PCB PRODUCTION PROCESS CAPEL Premium PCB, what makes it different?
Raw Material	High performance FR4; Halogen-free FR4; Large size & stable performance material;
Ink	High performance ink; Halogen-free ink;
Drilling	Numerical control drilling; Laser micro drilling;
PTH	Copper plating; Nanometer graphene coating;
Electroplating	Gantry style electroplate; VCP continuous vertical plating;
Trace	Parallel light exposure process; LDI laser exposure process;
Etching	Chemical etching; Laser etching; Vacuum etching;
Stack-up	Hot oil press machine (large-scale);
Soldermask	Exposure developing process; Silkscreen printing process; Electrostatic spraying process; Vacuum printing process; Resin/ink plug hole process;
Silkscreen	Screen printing process Hd inkjet printing process
PCB Profile	High precision numerical control machine tab-routing process;